Sunstone’s micro welding solutions are perfect for microjoining and thermocompression bonding. When bonding small wires (1-3 mil diameters) from one connection pad to another, Sunstone’s dual pulse welders and micro weld heads are recommended as the optimal setup for thermocompression bonding applications.
In the past, thermocompression bonding processes yielded a large number of failures caused by weak wire bonds. Sunstone’s high-tech products provide a guaranteed solution for improving thermocompression bonding processes by providing reliable bonds and repeatable manufacturing processes.
For more information regarding thermocompression bonding, please Contact Us.
Thermocompression Bonding Equipment Recommendations:
Dynamic Dual Pulse Welder for Thermocompression Bonding
Micro Weld Heads for Thermocompression Bonding